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Showing results: 436 - 450 of 628 items found.

  • Fault Diagnostics in Power-Off State

    QT55 - Qmax Test Technologies Pvt. Ltd.

    Signature Method of Testing is also known as VI Trace Characteristics, is a proven fault diagnostics technique in Power-Off state while testing a board. By applying known wave from signal with desired Voltage, Source impedance and Frequency of the stimulus signals, depending upon the test node and its characteristics, a Voltage (V) vs Current (I) graph is plotted and studied.

  • ARINC-429 Module

    M4K429RTx - Excalibur Systems, Inc.

    The M4K429RTx is an ARINC-429 multi-channel test and simulation module to be used on the Excalibur 4000 family of carrier boards. The module supports up to ten ARINC-429 channels in any combination of transmitters and receivers. Each of these channels feature error injection and detection capabilities. The receive channels allow for the storage of all selected Labels with status and time tag information appended to each word.

  • Short Span Compression Tester

    17-36 - Testing Machines, Inc.

    The 17-36 Short Span Compression Tester measures the compression strength of paper and board. The span or gap is set to a distance between 0.3-0.7mm. When performing a compression test on such a short distance, the stability of the clamps and instrument are critical. The 17-36 Short Span Compression tester incorporates a precision mechanical design to reduce frictional errors, providing unmatched accuracy and repeatability.

  • Software Tool Especially Designed for Production Process Supervision

    LEON OP - Konrad Technologies GmbH

    The Leon OP is a software tool especially designed for production process supervision. Therefore, the application provides the following key features:- Execution of KT ICT sequences or NI TestStand sequences- Parallel, semi-parallel or sequential execution of test sequences, individually definable per Test Sequence- Customizable User Interface, simple or detailed test views, grid or board layout arrangement possibilities- Tracing into sequence execution- User management with different user levels and restrictions per user group- Displaying execution results and statistics by panel or nest- Supporting interaction with an automation (e.g.: handler system)- Supporting interaction with a process control / MES system- Integrated Callback structure to adopt to different workflows- Maintenance view for fast displaying of fails inside a board- Result History View to quickly access the last test results- Store execution results in result files with user defined format- Autostart-option for running application in automation mode without any operator interaction at all- Several abortion criteria to abort execution by fail count (consecutive or time based)- A Maintenance View for viewing testprobe locations on the DUT is available via Aster Quadview

  • VME / VME64x Load Board 6U

    1940000140-0000 - ELMA Electronic, Inc.

    The Elma Electronic VME / VME64x load board provides a means to test the power generated by and cooling capability of VME systems. This makes it easier to locate hot spots in the chassis, so the airflow can be properly directed.

  • System Level Test and Burn-in Solutions

    Aehr Test Systems

    System Level Test (SLT) is a paradigm shift from traditional structural and functional testing. The device is tested in a complete, integrated system to evaluate its compliance against specified requirements. The system approach allows for higher and more cost-effective test coverage especially for multi-function and non-deterministic devices. It also brings new integration and test challenges like: ..Designing test fixtures on Burn-in Boards with system components ...

  • Flex Test Fixtures

    Z-Axis Europe

    FTFs are test fixtures which are dedicated for testing flex-based components and assemblies such as displays, touch panels and more. A weak spot in a typical functional test system is the method to connect DUT flexible cable to a circuit board where the simple method of attaching the flex directly with an ZIF or LIF connector fails.

  • Test Fixture Kits

    Equip-Test Kft.

    More then ten years of experience in special, customized engineering and manufacturing brought us to the highest level of creating reliable, flexible and robust Test Fixtures. Currently our HQ is located in Vecsés, Hungary together with our R&D. Equip Group has Test Fixture Kit manufacturing plant in Serbia, focusing on supplying competitive, high – quality and high – volume products for the global market.With more then 180 employees, Equip – Test is able to offer our customers turnkey solutions in fixturing with test program generation. No matter if you have a simple or complex, high-density PCB (Printed Circuit Boards), or if you have DUT (Device Under Test) already assembled into metal or plastic housing, we can offer you a very stable technical solution.

  • JTAG Debugger Software

    JSCAN - Navatek Engineering Corp.

    JSCAN lets you view and control JTAG pins in real-time without having to touch your board! With a simple click of your mouse, you can set pins HIGH or LOW and observe the results right on your PC.J-SCAN works independently of any logic inside the JTAG device, you do not need any special firmware, code or logic installed. View and control pins in real-time, program FLASH memories, create test macros, for system test, easy to use graphical interface and affordable.

  • 6U CompactPCI Multifunction I/O Board

    CPCI-MFIO-6U - ALPHI Technology Corporation

    The CPCI-MFIO-6U is a 6U CompactPCI multifunction I/O board. The CPCI-MFIO-6U offers 32 channels of 16 bit A/D, four 16 bit D/A, 16 digital I/O, counter / timers, and one PMC expansion slot for additional I/O. There is a local 60 Mhz TMS320C31DSP processor to supervise all the I/O activity. The DSP can be programmed by the end user to execute application specific code. The CPCI-MFIO-6U is ideally suited for factory automation, automatic test equipment, test & measurement, and control systems.

  • Plugbord

    3682 - VECTOR Electronics and Technology, Inc.

    44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers.​Interleaved buses pattern on wiring side only solder- coated for user convenience. Bus outline silkscreened on component side to facilitatecomponent placement. Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing. Unclad test point area at top of board Row and column legends provided

  • Plugbord

    3682-2 - VECTOR Electronics and Technology, Inc.

    44 Gold plated edge contacts (22 each side)on 0.156"(3.96mm) centers.​Interleaved buses pattern on wiring side only solder- coated for user convenience.Bus outline silkscreened on component side to facilitatecomponent placement. Mounts DIPs with 0.3”, 0.4” & 0.9” lead spacing. Unclad test point area at top of board Row and column legends provided

  • Transformers

    Vertical Space - SV Probe, Inc.

    With our TrioTM vertical and LogicTouchTM fine pitch vertical technologies an interconnect, otherwise known as a space transformer (ST), is used between the printed circuit board and the probe head, transferring the test signal. SV TCL provides a variety of space transformers, each with its own specific benefits and applications. SV TCL offers a number of space transformer options including:

  • ​Non-terminated SPDT Indium Phosphide Active RF Switch

    Part No. In​P1​​012-​40​ - Teledyne Defense Electronics Relays & Coax Switch

    ​Non-terminated SPDT Indium Phosphide Active RF Switch • 3mm x 3mm x 1mm package size • 100ns switching time• Monolithic solid-state switch with no mechanical wear• Flip-chip packaging provides shock & vibration resistance• ENEPIG surface finish for solder bonding• Low loss package with organic overmold• Test board with K-connectors​ can be provided​​DC-40GHz​40Gbps

  • ​​Non-terminated SPDT Indium Phosphide Active RF Switch

    Part No. In​P1​​012-​60​ - Teledyne Defense Electronics Relays & Coax Switch

    Non-terminated SPDT Indium Phosphide Active RF Switch • 3mm x 3mm x 1mm package size • 100ns switching time• Monolithic solid-state switch with no mechanical wear• Flip-chip packaging provides shock & vibration resistance• ENEPIG surface finish for solder bonding• Low loss package with organic overmold• Test board with K-connectors​ can be provided​​DC-60GHz​40+ Gbps

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